Description
300W Hot air rework station with automatic cooling system.
LED digital display, showing current temperature and status.
MCU confirms fast heat up, accurate and stable control on temperature.
Temperature range: 100-500?C.
Suitable for desoldering work on various components such as SOIC, CHIP, QFP, PLCC and BGA.
Includes three nozzles.
Model No. SEASD007
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